Electrophoretic deposition of fluorescent Cu and Au sheets for light-emitting diodes.
نویسندگان
چکیده
Electrophoretic deposition (EPD) is a conventional method for fabricating film materials from nanometer-sized building blocks, and exhibits the advantages of low-cost, high-efficiency, wide-range thickness adjustment, and uniform deposition. Inspired by the interest in the application of two-dimensional (2D) nanomaterials, the EPD technique has been recently extended to building blocks with 2D features. However, the studies are mainly focused on simplex building blocks. The utilization of multiplex building blocks is rarely reported. In this work, we demonstrate a controlled EPD of Cu and Au sheets, which are 2D assemblies of luminescent Cu and Au nanoclusters. Systematic investigations reveal that both the deposition efficiency and the thickness are determined by the lateral size of the sheets. For Cu sheets with a large lateral size, a high ζ-potential and strong face-to-face van der Waals interactions facilitate the deposition with high efficiency. However, for Au sheets, the small lateral size and ζ-potential limit the formation of a thick film. To solve this problem, the deposition dynamics are controlled by increasing the concentration of the Au sheets and adding acetone. This understanding permits the fabrication of a binary EPD film by the stepwise deposition of Cu and Au sheets, thus producing a luminescent film with both Cu green emission and Au red emission. A white light-emitting diode prototype with color coordinates (x, y) = (0.31, 0.36) is fabricated by employing the EPD film as a color conversion layer on a 365 nm GaN clip and further tuning the amount of deposited Cu and Au sheets.
منابع مشابه
Thin-film Encapsulation of Organic Light-Emitting Diodes Using Single and Multilayer Structures of MgF2, YF3 and ZnS
In this research, the lifetime of green organic light emitting diodes (OLEDs) is studied using four passivation layers. To encapsulate the OLEDs, MgF2, YF3, composed of alternating MgF2/ZnS and YF3/ZnS layers were grown by thermal vacuum deposition. Measurements show that the device lifetime is significantly improved by using YF3 and ZnS as passivation layers. However, diodes encapsulated by Mg...
متن کاملEffects of LED Light on Seed Emergence and Seedling Quality of Four Bedding Flowers
Recently much attention has been paid by horticulturists to light-emitting diodes as a new source of economical and spectral-selective light. The reason is mainly coming from their versatility in handling and mounting, long working time, wattage use efficiency and lower heat production. In this study we examined their potential in promoting seed germination and producing quality flower seedling...
متن کاملApplication of Ultraviolet Light-Emitting Diodes to the Removal of Cefixime Trihydrate from Aqueous Solution in the Presence of Peroxydisulfate
The present research involves effectual parameters on Cefixime trihydrate removal from aqueous solutions. Antibiotics are the main contributions in pharmaceutical waste; their presence causes major concern. The extensive utilization of antibiotics in aquaculture and prescriptions has led to the cultivation of various antibiotic-resistant bacteria and genes in wastewater. The UV-LED/S2O82- pr...
متن کاملGrowth and characterization of thin Cu-phthalocyanine films on MgO(001) layer for organic light-emitting diodes
Surface morphology and thermal stability of Cu-phthalocyanine (CuPc) films grown on an epitaxially grown MgO(001) layer were investigated by using atomic force microscope and X-ray diffractometer. The (002) textured β phase of CuPc films were prepared at room temperature beyond the epitaxial MgO/Fe/MgO(001) buffer layer by the vacuum deposition technique. The CuPc structure remained stable even...
متن کاملDesigning and Manufacturing Microelectronic Packages for High-Power Light-Emitting Diodes
A new microelectronic package was designed for a high-power light-emitting diode (LED). The objective was to build a package that enables the LED to operate with currents as high as 2 Amps. An innovative thin-film interface has been developed to electrically connect the cathode of the LED die to a 22AWG Cu wire. This thinfilm interface is wirebondable and solderable, and consists of three layer...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید
ثبت ناماگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید
ورودعنوان ژورنال:
- Nanoscale
دوره 8 1 شماره
صفحات -
تاریخ انتشار 2016